Japan, Oct. 30 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related detai... Read More
Japan, Oct. 30 -- DENSO CORP has got intellectual property rights for 'SYSTEM FOR ADJUSTING SENSATION OF WARMTH.' Other related details are as follows: Application Number: JP,2021-133617 Category (F... Read More
Japan, Oct. 30 -- KIRIN HOLDINGS CO LTD,MEIJI UNIV has got intellectual property rights for 'TASTE PRESENTATION DEVICE.' Other related details are as follows: Application Number: JP,2021-134526 Cate... Read More
Japan, Oct. 30 -- JAPAN INDUSTRIAL TESTING CORP,HANSHIN EXPRESSWAY ENGINEERING CO LTD,SHINKO WIRE CO LTD,KYOWA ELECTRON INSTR CO LTD has got intellectual property rights for 'TENSION DETECTING METHOD ... Read More
Japan, Oct. 30 -- KOYAMA YOSHIYUKI,TOAGOSEI CO LTD has got intellectual property rights for 'ANALGESIC AND METHOD FOR PRODUCING THE SAME.' Other related details are as follows: Application Number: JP... Read More
Japan, Oct. 30 -- HOCHIKI CORP has got intellectual property rights for 'DISASTER PREVENTION MONITORING SYSTEM.' Other related details are as follows: Application Number: JP,2022-207793 Category (FI... Read More
Japan, Oct. 30 -- TOYOTA MOTOR CORP,YAZAKI CORP has got intellectual property rights for 'BATTERY TERMINAL UNIT.' Other related details are as follows: Application Number: JP,2021-132148 Category (F... Read More
Japan, Oct. 30 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows: Application Number: JP,2021-132371 Category (FI): ... Read More
Japan, Oct. 30 -- ROHM CO LTD has got intellectual property rights for 'OSCILLATOR CIRCUIT, HIGH-SIDE SWITCH, ELECTRONIC APPARATUS, AND VEHICLE.' Other related details are as follows: Application Num... Read More
Japan, Oct. 30 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'DRESSING RING AND METHOD FOR GRINDING WORKPIECE.' Other related details are as follows: Application Number: JP,2021... Read More